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金屬化陶瓷–用于電子元件和線路的錫焊

Metalized Ceramics for Soldering of Electronic Elements and Circuits

Alumina ceramic substrate offers excellent high frequency characteristics and high temperature-withstanding, corrosion -resistant, non-deformation, electrical insulation, and vaccum tight. Ceramic surface after metalization can be connected to metals by brazing. Further more, after gold-plating or tin-plating, it can be mounted and soldered on PCB. It has been widely used in vacuum electronic components, conductor base, resistor base, I.C. substraste, etc.

 

	項目 Items 單位 Unit 用于錫焊 for Soldering 作業(yè)溫度 Operation Temperature °C 200-400 抗拉強(qiáng)度 Pull-Withstanding MPa >=10 潤濕性 wettability   >90% (for Tin/Rosin) 打線/點(diǎn)焊 Bonding/Welding (?0.14mm ?copper wire) >=150gf (no plated layer peel-off )